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The Model IBS/e is a high vacuum thin film deposition system designed to precisely deposit sub-nanometer grain, conductive coatings onto specimens prior to examination in the electron microscope. Thin, conductive films are deposited onto specimens to prevent charging effects and to enhance contrast. Thin films are deposited using two ion beam sources directed at a target material, eliminating radiation or heating effects common with other coating techniques. Extremely thin, continuous metal or carbon films are deposited without risking damage to delicate features present on the specimen. Virtually any target material can be used for ion beam deposition with precise control over the deposition thickness. An optional third ion source allows specialized ion beam etching techniques to be employed. The ability to deposit amorphous, continuous films makes the IBS/e system ideal for high resolution electron microscopy techniques.
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IBS/e Standard Configurations and Images

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IBS/e-DD This configuration is the standard IBS/e with two high voltage ion guns in the two deposition ports. It is used for low rate deposition for high resolution SEM coatings. Request Quote  
IBSe-DE IBS/e-DE This configuration is the standard IBS/e with one high voltage ion gun in the depo port and one high voltage ion gun in the etch port. It is used for low rate deposition for high resolution SEM coatings and for ion etching, slope cutting, and ion polishing a sample in a small area. The deposition rate will be half of that for the two deposition configuration.
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IBS/e-KDCDUAL IBS/e-KDCDUAL This configuration is the IBS/e with one KDC-10 ion source in the upper depo port and another KDC-10 ion source in the etch/polish port. The high voltage guns and power supply are removed from this system. The system is integrated with the KRI power supply which is external to the IBS/e system. A switchbox is included in the system to switch power between the depo ion source and the etch ion source based on the IBS/e mode. An auxiliary gas line is added for reactive sputter deposition capability or reactive ion etching capability. The system is used for low to very high rate deposition metal or oxide coatings and for ion etching, slope cutting, and ion polishing a sample in a large area with low energy ions or neutrals. Request Quote Qty.
   
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