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Application Notes - Complete Listing
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Number	Title - Click on Title to Print	Instruments Used
1	Characterizing Lip Effect on Thin Metal Foils	310
2	Evaluating the Precision of Abrasive Slurry Disc Cutting Techniques on GaAs	360
3	Characterization of Model 38001	380, 38001
4	Cutting 8 mm Discs from Hard Disc Drives	380
5	Cutting Thin Si Wafers	380
6	Lapping and Polishing ZnO Single Crystals to Optical Smoothness	920, 151
8	Preparation of Surface Mount Packages Directly on PC Boards for Backside Emission Analysis	575
11	Preparation of Hard Disk Drive Magnetic Recording Media for XTEM Analysis	590
12	Cross Sectioning Small Hole Arrays	590
13	Optimizing Cutting Conditions for Polymeric Materials	650, 660
14	Characterizing the Model 660 Low Speed Diamond Saw	660
15	Precision Cutting BGA Packages for Ball Bond Integrity Testing	850
16	Cutting Highly Different Hardness Materials for Adhesion Analysis	850
17	Cutting Glass Optical Ferrules using Two Cutting Methods	850, 650
18	Cutting DRAM IC's to Specific Area Prior to FIB Preparation	850
19	Low Damage Cross Sectioning of Flip Chip Packages	850
20	Precision Cutting of Packaged IC Devices from Printed Circuit Boards	850
21	Characterizing the Model 850 Wire Saw	850
22	Polishing Protocol for Glass Cover Slides	920, 92002
23	Lapping and Polishing Glass to Optical Smoothness	920, 155, 92002
24	Preparing Planar Specimens of Entire PC Board Components	920, 92003
25	Lapping and Polishing SiC Wafers	920, 92002, 155
26	Optical Polishing Polystyrene Discs to Specific Dimensions	920, 155, 92002
27	Using the Model 25010 Oriented Crystal Polisher on Model 920	920, 92002, 25010
31	Evaluation of Solvent Free Removal of Waxes	Wax, WaxCut
34	Preparation of GaN / Sapphire for TEM using Tripod Polishing	590, 920, IV3
35	Ion Milling Parameters for Various Materials Systems	IV3
36	Plasma Cleaning of Various Specimens for use in TEM	PC 150
37	Cutting Rates of Materials on Various Cutting Instruments	650, 660, 850, 860
38	Characterizing Low and High Concentration Diamond Wheels for Cutting Materials	650
39	Comparing Cutting Times of Selected Diamond Wheel Types	650
40	Lapping and Polishing LiNbO3 Crystals at Specific Angles	920, 163, 92002
41	Cutting Fiber Optic Connectors Using Model 850	850
43	Cutting CdTe Detector Discs to Specific Diameter	360
44	Cutting AlC Composite for Shaping	850
46	Lapping and Polishing Si Die and Wafers	920, 155
47	Lapping and Polishing Si Die to Optical Polish Quality	920, 150
48	Preparation of Otoliths for Laser Chemical Analysis	920, 195
49	Cutting Ti Nb Alloy to Specific Thickness	650
51	Cutting Encapsulated Cu Sheet using Model 850 Wire Saw	850
52	Cutting Various Composite Materials for Microscopic Investigation	660
53	Sample Preparation of Optical Crystals: Cutting and Polishing Methods	850, 920, 155E
54	Lapping and Polishing Basics	920
55	GaN / Sapphire Prepared by the MicroCleave Technique	520
56	Lapping and Polishing GaN Fiber Towers for VCSEL Applications	920, 150
57	Parallel Laping of Devices for Deprocessing	920, 155
58	Evaluation of the Polishing Quality for Edge Polished Silicon	920, 155E
59	EELS of PLD DLC	520
60	Prethinning for FIB TEM Sample Preparation using the Small Angle Cleavage Technique	520
61	SACT Preparation of MBE Grown QWIP on GaAs	520
62	The Small Angle Cleavage Technique: An Update	520
63	Plasma Trimming Applications	PC 2000
65	Monitoring and Measuring Plate Flatness	920
66	Selecting a Diamond Wheel	650
68	Improving High Resolution Images using Low Energy Ion Milling	TL-GM1
70	Cutting Steel/Cr Alloy using Various Diamond Wheels	650
71	Improving Surface Quality of Petrographic Sections	920, 155
72	Comparing Wax Layer Thickness After Mounting	Consumables
74	Maintaining Plate Flatness Prior to Lapping and Polishing	920
76	Applications of the GentleMillT to FIB Prepared TEM Specimens	TL-GM1
77	A Method for Pre-FIB Specimen Preparation	650, 920, 590
79	Processing YVO4 and Electro-Optic Crystals for Small Scale Fabrication	920, 147D, 850
83	Lapping and Polishing II-VI Semiconductors	920,
84	A Method for PVC Specimen Preparation	920, 150
85	Producing Smoothly Etched Surfaces using RIE	RIE2000
86	Evaluating Surface Roughness of Si Following Selected Lapping and Polishing Processes	920 / 155
87	Basic Arrangement of Model 910 and 920 for Processing Cross Sections	920 / 910 / 590 / 595
89	Kerf Loss Comparisons	850 / 650
91	Ion Beam Sputtering: Practical Applications to Electron Microscopy	IBS/e
92	Evaluating Surface Roughness of Ion Beam Sputtered Iridium Using a Large Area Stage	IBS/e
93	Proper Use of Wire Blades for the Model 850	850
94	Improved Sample Mounting for the TL-GM1 GentleMill	TL-GM1
96	A Simple and Repeatable Zeroing Process for the Model D 500i Dimpler	D500i
97	Accessories for the Model 920 Lapping and Polishing Machine	920
98	Setting up and Using Digital Controlled Lapping and Polishing Fixtures	920, 155D
106	Cu Composite Plate Conditioning for Flatness	920, LP920C
107	Model 93031 Flattness Monitoring Kit	920, Lapping
108	SBT Statolith preparation	150L, 180
109	KA160 7mm Catalyst Support	920, Acrylimet
110	Cross Sectional Prep of CEO2 films on NiW	865, 920, 150L, IBSe
111	Cross sectional Prep of GaAs devices	590, 910, consumable
112	Quartz tips cut with 850 wire saw	850
113	PVC plastic sample preparation	650, 920, Acrylimet
114	Precision Dimpling of MgF2 for UV properties	D500i
115	SBT Sardine Otolith Preparation	920, 150L, 590, Rail Polisher
116	Precision sectioning of LiF doped crystals	850
117	Chemical Thinning Silicon with Model 550	550
120	Precisely Locating the Center of a Sample Punched with the Model 310.pdf	310
121	What is the Thickest Sample That Can Be Punched with Model 310.pdf	310
123	Kauf Man Ion Source IBS/e, KDC-10	IBS/e
125	Ion Shadow Digging IBS/e, KDC-10	IBS/e